Dr. Noren Pan, CEO and President
Dr. Pan, who co-founded MicroLink Devices in 2000, currently serves as President and CEO. His previous position was Chief Scientist of Kopin. Dr. Pan received a Ph.D. from the University of Illinois at Urbana- Champaign in 1988. He has published more than 60 scientific papers. He is a senior member of IEEE and was inducted to the Chicago Entrepreneurial Hall of Fame in 2007.
Dr. Mark Osowski, Vice-President of Engineering and Business Development
Dr. Osowski joined MicroLink Devices in November 2009. Prior to MicroLink, Dr. Osowski worked as the Terrestrial Product Development Manager at Boeing-Spectrolab. Dr. Osowski has over 15 years experience in the compound semiconductor industry. His research experience has covered a broad range of device designs/applications, including; high efficiency multijunction solar cells, high power multimode pump lasers, and directly modulated diode lasers for telecom and datacom applications. Dr. Osowski received his Ph.D. degree in Electrical Engineering from the University of Illinois at Urbana-Champaign in 1998. He has over 50 publications and two patents in the field of compound semiconductor devices.
Mr. Andree Wibowo, MOCVD Production Director
Mr. Wibowo joined MicroLink Devices in 2001 after receiving his B.S in Chemical Engineering from University of Wisconsin at Madison. He has served in several roles, including Production Engineer, and Production Manager. Mr. Wibowo was responsible for transitioning HBT and BiFET devices from R&D to volume manufacturing and obtaining ISO 9001:2000 certification for high volume production. Mr. Wibowo was responsible for developing volume production of epistructures for epitaxial lift-off solar cells for space and terrestrial applications. While working full time at MicroLink, Mr. Wibowo earned an M.B.A in Finance and Economics from University of Chicago Booth School of Business in 2011.
Dr. Chris Youtsey, Director of Fabrication
Dr. Youtsey joined MicroLink Devices in December 2007. Previously he worked at TriQuint Semiconductor, where he contributed to both the Research and Development group and the Production Process Engineering group. Dr. Youtsey received his Ph.D. degree in Electrical Engineering from the University of Illinois at Urbana-Champaign in 1998. He is the author of 30 peer-reviewed journal publications and has received four patents.
Dr. Sudersena Rao Tatavarti, Technical Director
Dr. Tatavarti joined MicroLink Devices in January 2007. He is responsible for the development of structures for solar cells and other devices. Previously, Dr. Tatavarti worked at Nortel Networks on MOCVD growth and processing of InP- based materials. Dr. Tatavarti received a Ph.D. in Solid State Physics from the University of Delhi in 1986. He has published more than 60 papers in refereed international journals and conference proceedings.
Mr. Glen Hillier, Manager of Design and Development
Mr. Hillier joined MicroLink Devices in October 2004. Prior to MicroLink, Mr. Hillier managed the high-speed epitaxial materials development group at Nortel Networks and was responsible for the insertion of InGaP HBT MMICs into OC 192 10 Gb/s optical communication systems. He also worked at Bell Northern Research (BNR) in Ottawa where he was instrumental in the development of MOCVD for long wavelength distributed feedback laser diodes, PIN/APD detectors, and Mach-Zehnder modulators used in optical communications systems. Additional work included the development and patenting of an inverted wafer rotation system for a state-of-the-art MOCVD system used by BNR. Mr. Hillier received his B.S. from the Applied Physics Honors program at the University of Waterloo, Ontario in 1985.
Mr. Ray Chan, Director of Solar Sheet Products
Mr. Chan joined MicroLink Devices in October 2008. Previously, Mr. Chan worked at TriQuint Semiconductor in Hillsboro, Oregon, where he was responsible for the development and sustaining of various sputtered metal deposition processes and electroplate activities. Mr. Chan was a project leader for the development and production ramp of CuSn pillar bump technologies on 150 mm and 200 mm wafers for flip-chip assembly and packaging. Mr. Chan received his B.S. and M.S. degrees in Electrical Engineering from the University of Illinois at Urbana-Champaign in 1995 and 1996.