MicroLink Devices designs and manufactures epitaxial material that is used in cellular phones and other wireless devices.
MicroLink currently produces InGaP epitaxial wafers, which are used in the manufacture of heterojunction bipolar transistors (HBTs). These transistors are used for high-volume cellular and WLAN applications and for RF test instrumentation. MicroLink also produces BiFET epitaxial wafers, which are used in the manufacture of power amplifiers (PAs) and switches. These devices are used in high-volume cellular applications. MicroLink’s epitaxial material has been used in more than 100 million mobile phones.
These epitaxial materials are grown on metalorganic chemical vapor deposition (MOCVD) tools that are designed for large-scale production. The tools are capable of high-volume growth on 4-inch and 6-inch GaAs and InP substrates.
MicroLink employs a team of skilled and experienced device engineers who will undertake the design of high performance HBT and BiFET structures, or will improve the performance of existing structures. Our design engineers work closely with manufacturing engineers so that new designs can quickly be transitioned to high-volume production.